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1號(hào)極限開關(guān) LS1(limit suitch 1)

232 bus的使用壽命已到或線路短路或斷路 232 bus error

488 bus的使用壽命已到或線路短路或斷路 488bus error

5S(整理、整頓、清掃、清潔、修養(yǎng)) 5S（Seiri-Seiton-Seiso-Seiketsu-Shitsuke)

5u之pp質(zhì)濾心 cartridge p.p 5u

ABC分類法 ABC classification

AUTO模 automatic molding system

A板 A plate

BT指示劑 eriochrome black t indicator

B板 B plate

CO2氣泡機(jī) CO2 bubbler

DIP 產(chǎn)品上的裂角任何一方向大于1.25mm且另一方向亦大于0.5mm拒


收 Any device having a chip out greater than 0.5mm in width (or depth) and 1.25mm in length is rejectable.

DIP 從膠體末端算起,支持棒突出部分不得大于0.25mm(SOP為


0.15mm)。 The product is rejectable when pad support protrudes more than 0.25mm from the end of the package body.(sop:0.15mm).





DIP：不符合腳量規(guī)之腳彎拒收。


Any device showing bent leads (in case of doubts use the applicable gauge) is rejectable.

DIP：不均勻的鍍層表面，使得小腳厚度大于0.4mm或?qū)挾却笥?.5mm或大腳以上厚度大于0.75mm，拒收。 Non-uniform solder such that a lead exceeds the dimensions of 0.4mm thick and 0.5mm wide below the seating plate, or an overall thickness of 0.75mm above the seating plane is rejectable.

DIP：從腳尖端到肩膀彎腳處，腳的鍍層表面須均勻且連


續(xù)。 Lead finish on the leads shall be smooth and continuous from lead tip up to and over bend of lead.

DIP：頂出孔不得高于膠體面或低于膠體表面


0.5mm。 Ejector marks more than above the surface or more than 0.5mm below the surface of the device is rejectable.

DIP：離膠體0.5mm以外之腳表面有浮起、剝落或鱗片狀等現(xiàn)象拒


收。 Lifting, peeling or flaking of the lead finish is rejectable excluding 0.5mm from the body.

DIP：小腳上不得有任何外來物造成之沾污。大腳上不得有大于0.15mm直徑圓面積之沾


污。 Package leads shall be free from attached foreign material except for foreign material located above the seating plane of the lead, not bigger than 0.15mm in diameter.

DIP：由于沖切造成之支持棒殘存凸出或大腳凹陷大于0.25mm拒


收。 Any lead with dam bar step dimensions exceeding 0.25mm is rejectable.

Driver board的使用壽命已到或線路短路或斷路 driver board error

EDTA-2NA 標(biāo)準(zhǔn)溶液 EDTA-2NA standard solution

Eprom的使用壽命已到或線路短路或斷路 eprom error

KBS 94 混床樹脂筒 leasing mix bed resin bottle, kbs 94

L/F存放架 stack loader

L/F放反將導(dǎo)致反彎腳。 Lead frame reverse will cause reverse bending.

L/F排放機(jī) Lead Frame Auto Loader Machine

L/F用剝錫劑 TLS-85a solde stipper for plastic package,TLS-85a





L/F用剝錫劑 TLS-85b solde stipper for plastic package, TLS-85b





L/F用剝錫劑 TLS-86 solder stipper for plastic package,TLS-86

L形尾塞 end plug (L)

L型尾塞 end plug(L)

MPU的使用壽命已到或線路短路或斷路 MPU error

N2流量 nitrogen gas flow rate

OC曲線 poprtation curve

P.P 打包袋 P.P Band

PDCA管理循環(huán) PDCA（Plan-Do-Check-Action)

PIN1標(biāo)示 PIN1 identification

PIN1標(biāo)示要有且與規(guī)格所訂的尺寸一


致。 The PIN1 identification must be present and in accordance with the specified dimensions.
PP材質(zhì)陽(yáng)極袋 anode bag p.p.
QA允收章 QA mark

QFP用的塑膠承載盤 QFP plastic tray

RAM的使用壽命已到或線路短路或斷路 RAM read/write error即RAM error

SOP：不均勻的鍍層表面，使得腳的寬度大于0.5mm或腳厚度大于0.25mm。 Non-uniform lead finish such that a lead exceeds the specified dimensions 0.5mm or leadl thickness exceeds 0.25mm is rejectable.

SOP：產(chǎn)品邊緣上的裂角寬或深大于0.2mm，長(zhǎng)大于0.6mm或露出體材料拒


收。 Any devices having a chip out greater than 0.2mm width(or depth) and 0.6mm in length or exposed lead frame material is rejectable.

SOP：頂出孔低于膠體表面0.2mm，或是高于膠體表面拒


收。 Ejector marks more than above the surface or more than 0.2mm below the surface of the device is rejectable.
SOP：腳浮不得超過0.1mm。 Lead coplanarity shall be within 0.1mm of one another in the vertical direction.

SOP：腳上不得有任何外務(wù)物之沾污，但如果是廢膠則不能大于50％腳寬為直徑的圓面


積。 Leads shall be free attached foreign material, flash shall not exceed 50% of the lead surface.
SOP：離膠體0.2mm以外之腳表面有浮起、剝落或鱗片狀等現(xiàn)象拒


收。 Lifting, peeling or flaking of the lead finish is rejectable excluding 0.2mm of the lead length from body.
SOP：由于沖切造成之支持棒殘存凸出或凹陷大于0.1mm時(shí)拒收。 Any lead with dam bar step dimensions exceeding 0.1mm is rejectable.
S形尾塞 end plug (S)
XX部門經(jīng)理 manager of XX department
XX電子有限公司 XX Electronics CO.Ltd
X管率 X-ray yield
X射線 X-ray
X-射線檢驗(yàn) X-ray inspection
安全光幕 safety curtain
安全庫(kù)存量 safety stock
安全眼鏡 safety glasses
氨水 ammoniam water
按下緊急按鈕。 Press the emergency button.
按需訂貨 lot for lot
昂球 lifted bond
昂楔 lifted wedge
凹模 cavity plate,cavity block
百萬分之一 PPM (parts per million)
柏拉圖 Pareto chart
板狀模組模具 plate mold
半導(dǎo)體 semiconductor
半球 insufficient ball size
半自動(dòng)框架輸送機(jī) off loader
包反 wrong orentation molding
包反 wrong orientation molding
包封 molding
包封 molding
包封模具 mold chase
包封模具 mold chase
包封偏差 molding mismatch
包裝 packing
包裝 packing
包裝盒(內(nèi)箱) packing box
包裝盒缺點(diǎn) packing defect criteria
包裝外箱 shipping box
保管費(fèi) carrying cost
保管費(fèi)率 carrying cost rate
保險(xiǎn)期 safety time
保壓時(shí)間 holdup time
保證進(jìn)氣通暢，散熱可靠 guarantee air inlet open, reliable heat
保質(zhì)期 shelf life
報(bào)廢 scrap
備注 remark
背金/銀 backside metal (Au/Ag)
背面 back side
背面打印 back marking
崩角 chip package
崩碎 chips
比重 specific gravity
比重 specific gravity
比重計(jì) hydrometer
閉環(huán)物料需求計(jì)劃 closed loop MRP
閉模時(shí)間 closing time
邊筋翹起 bending side rail
邊晶 edge die
邊晶 reject die around slice edge
邊框 side rail
邊沿芯片 edge die
編帶 Tape & Reel
編帶 tape/real
編帶拉力測(cè)試 peel back force test
編織層 braid
扁平電纜 flat cable,ribbon cable
扁球 flat ball
變差 variation
變色 discoloration
變色（發(fā)黃，發(fā)黑，發(fā)花，水漬，酸斑） discolor(yellowish,blcken,water mark)
變色、氧化、浮起 discoloration/oxidation/lifting
變形 deformed
變形 deformed/distort
標(biāo)桿瞄準(zhǔn) benchmarking
標(biāo)簽 label
標(biāo)簽、封裝、QA允收章 defect criteria labelled boxes/seal/QA mark
標(biāo)簽內(nèi)容錯(cuò)誤 wrong contents on label
標(biāo)簽內(nèi)容與內(nèi)盒產(chǎn)品不符合 contents of label do not correspond with contents of box
標(biāo)簽位置不對(duì)、標(biāo)簽貼反 wrong location/orientation of label
標(biāo)準(zhǔn) criteria
標(biāo)準(zhǔn)操作程序（作業(yè)指導(dǎo)書） SOP（Standard Operating Procedure）
標(biāo)準(zhǔn)產(chǎn)品成本 standard product cost
標(biāo)準(zhǔn)單位運(yùn)轉(zhuǎn)工時(shí) standard unit run hour
標(biāo)準(zhǔn)工資率 standard wage rate
標(biāo)準(zhǔn)機(jī)器設(shè)置工時(shí) standard set up hour
表面安裝 surface mounting
表面粗糙 dull finish / rough surface
表面貼裝式 surface mount technology(SMT)
表面污染 surface contamination
別忘了在不良產(chǎn)品上作記號(hào) Don't forget to mark at NG products.
冰箱 refrigerator
冰柱狀 icicle
丙酮 acetone
餅夾 Pellet Tong
波峰焊 wave soldering
玻璃棒 glass rod
玻璃膠 glass (epoxy for glass)
玻璃轉(zhuǎn)換溫度 grass transition temperature
薄膜氣泡 tape bubbles
薄片，鋸齒狀 flake
補(bǔ)焊 rebonding
補(bǔ)零 remanence fill
補(bǔ)足欠交 fill backorder
不得有任何金屬層腐蝕 Ａny metallization corrosion is rejectable
不合格 ninconformity
不合格品 ninconformance
不活動(dòng)報(bào)告 no action report
不良品 reject unit (RJ)
不良數(shù)管制圖 P N chart
不相同蓋印 different marking
不粘 Non-Stick
不正確的周期碼 incorrect date code
布線錯(cuò)誤 wrong bonding
步驟 process/step
部分蓋印 partial marking
擦痕 scratches
擦傷 scratches
擦錫 solder scrape
材料 material
材料清單 BOM（bill of material）
財(cái)務(wù)部 financial department(FD)
采購(gòu)訂單跟蹤 purchase order tracking
采購(gòu)訂單價(jià)格 price purchase order
采購(gòu)計(jì)劃法 vendor scheduling
采購(gòu)計(jì)劃員 vendor scheduler
采購(gòu)員 buyer
參數(shù) parameter
殘料率 scrap factor
殘?jiān)U屑 residues
倉(cāng)庫(kù)庫(kù)位類型 inventoty location type
倉(cāng)位備注 location remarks
倉(cāng)位代碼 location code
倉(cāng)位數(shù)量 quantity at location
倉(cāng)位狀況 location status
操作規(guī)程（操作說明書/操作手冊(cè)） operation manual
操作員 operator
測(cè)試 test
測(cè)試機(jī)診斷 test diagnostic
層 level
層流臺(tái) lamina flow
插孔 socket contact
查找和確認(rèn)根本原因 Define & Verify Root Cause
差色劑 colorant
產(chǎn)量 through put
產(chǎn)品 product
產(chǎn)品（封裝體） package
產(chǎn)品長(zhǎng)度 packqge length
產(chǎn)品結(jié)構(gòu)樹 production tree
產(chǎn)品控制 product control
產(chǎn)品寬度 package width
產(chǎn)品率 production rate
產(chǎn)品設(shè)計(jì) package design
產(chǎn)品特殊特性 special product characteristic
產(chǎn)品外形測(cè)量 measure for package out-line
產(chǎn)品線 production line
產(chǎn)品在管中 products in tubes
產(chǎn)品在管中方向錯(cuò)誤 wrong orientation of products in tube
產(chǎn)品質(zhì)量先期策劃和控制計(jì)劃APQP advanced product quality planning and control plan
廠際需求 interplant demand
超波膜 UV tape
超聲波清洗機(jī) ultrasonic clearing machine
超音波功率 bond power
超音波清洗 F/S finesonic clean
車床 engine lathc
車間作業(yè)管理 shop floor control
塵粒 particle
塵粒計(jì)數(shù)器 particle counter
塵流臺(tái) laminar flow
沖歪率 wire sweep rate
沖彎率 wire deflection rate
沖壓車間 stamp workshop,press workshop
沖壓模具 die
沖壓速度 injection setting
沖圓 fan out
純水 deionized water (DI water)
純銅散熱片 Copper Heat Sink
次品率 yield lost
次要缺點(diǎn) minor defect
次要缺陷 minor failure
打包帶太松 P.P Band too loosen
打包機(jī) packing machine
打不粘 Non-stick
打次 defect
打火棒 E.F.O.touch
打線速度 bonding speed
打線圖 bond diagram
打印 marking
打印 marking
彈坑 crater
彈匣 cassette/magazine
氮?dú)夤? N2 cabinet
刀痕毛刺 kerf chipping
刀片 punch
刀片 punch
導(dǎo)電性 conductive
導(dǎo)電桌墊 conductive table mat
導(dǎo)軌（流道） workholder
導(dǎo)套 bushing
導(dǎo)線 wire
導(dǎo)柱 guide pin
導(dǎo)柱 post
導(dǎo)柱（標(biāo)桿） post
第1腳記號(hào) pin 1 dot
第二點(diǎn)球焊功率 2nd bond power
第二點(diǎn)球焊時(shí)間 2nd bond time
第二點(diǎn)球焊壓力 2nd bond force
第二點(diǎn)脫落 second bond peel off
第一點(diǎn)球焊功率 1st bond power
第一點(diǎn)球焊時(shí)間 1st bond time
第一點(diǎn)球焊壓力 1st bond force
第一點(diǎn)虛焊 1st bond non-stick
第一只腳 pin 1 indicator
點(diǎn)火器 spark gun
點(diǎn)澆口 pin-point gate
點(diǎn)膠 die coating
點(diǎn)膠步驟 procedure for chip coating
點(diǎn)膠機(jī) chip coating machine
點(diǎn)膠缺點(diǎn) chip coating defect
點(diǎn)膠污染 Dimensions contamination.
點(diǎn)膠一般缺點(diǎn) Chip coating general defect.